Bona Semiconductor focuses on the R&D and manufacturing of high-end wafer bonding equipment. Our technologies are widely deployed in cutting-edge sectors including advanced packaging, semiconductor device fabrication, wafer-level heterogeneous integration, 3D stacking, and sensor chip manufacturing. We have successfully developed a full lineup of equipment covering wafer hybrid bonding, high-vacuum permanent wafer bonding, 2.5D/3D temporary bonding, temporary debonding cleaning, as well as positive/negative pressure cleaning systems.

The company operates an 8,000 sq.m modern R&D and manufacturing base, equipped with a dedicated 500 sq.m Class 100 cleanroom laboratory to provide professional prototype trial services for customers. Our team gathers top domestic and international technical talents with independent capabilities to develop new bonding and debonding processes. We have established a comprehensive layout: Jiashan serves as our core R&D and production hub, while Lingang and Zhangjiang in Shanghai function as dual centers for technology research and marketing.

We maintain efficient synergy between technological breakthroughs and market expansion. Our products have been supplied to multiple world-renowned semiconductor enterprises. By delivering high-precision, process-stable, cost-effective wafer bonding equipment and integrated solutions, we accelerate the localization of high-end semiconductor equipment in China.