Core Equipment · Smart Future
主要特点
This system is primarily used in fields such as integrated circuits and advanced packaging. It is designed to peel the glass substrates from the wafers after the manufacturing process. The separation process is simple, and the glass substrates can be recycled and reused.
规格参数
| UV Lamp Tube | 250mm |
| Irradiation Energy | 12000mJ/cm2 |
| Ultimate Vacuum | 100Pa |
| WPH | 8 |
BONA Semi-conductor —— Innovation in Chips, Unity in Progress
Copyright 2026 BONA Semi-conductor Equipment (ZheJiang) Co., LTD All Rights Reserved