Core Equipment · Smart Future
主要特点
This system is primarily used in the semiconductor power device industry. It involves using a laser to remove excess adhesive from the edges, followed by wet cleaning. The advantages include compatibility with subsequent processes, high throughput and cost-effectiveness.
规格参数
| Laser Type | CO2 Laser |
| Laser Power | 30W |
| Cleaning Rotation Speed | ≤3000rpm |
| WPH | ≥25 |
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