Core Equipment · Smart Future
主要特点
This system is suitable for the manufacturing processes of integrated circuits, 2.5D/3D integrated chips, fan-out wafer-level/panel-level packaging, III-V (gallium nitride) or silicon carbide devices, as well as other ultra-thin devices. The system enables fully automated replenishment, filtration and recycling of the wet chemical cleaning solution.
规格参数
| Product Compatibility | Compatible with 8-inch and 12-inch wafers and frame wafers |
| Laser Power | 5–30 W (selectable) |
| Shaping Spot Size | Up to 160 × 160 μm (selectable) |
| Optional Functions | Plasma Cleaning and Carrier Recovery |
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