Core Equipment · Smart Future
主要特点
This system is primarily used in fields such as integrated circuits and advanced packaging. It employs negative pressure alongside a wet cleaning process to remove flux from confined spaces. The advantages include high cleaning efficiency and suitability for narrow gaps between small bumps on large chips.
规格参数
| Ultimate Vacuum | 5KPa |
| Spindle Speed | ≤3000rpm |
| Hot Plate Temperature | RT~120℃ |
| WPH | ≥6 |
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