Automatic Coating and Development Machine_Coating Machine_Products__BONA Semi-conductor Equipment (ZheJiang) Co., LTD

Automatic Coating and Development Machine

1. The heating plates utilise progressive baking method.

2. The equipment has a small footprint and offers a high throughput and flexible configuration of process chambers.

3. An electric adhesive pump is used and the adhesive and developer solution lines can be kept at a constant temperature using a water bath.

4. It is capable of handling 5 mm warped wafers and ultra-thin wafers.

5. Optional EFEM and interface modules are available to enable inline mode.

6. Compatible with two different wafer sizes.

Device Configuration	4C、4D、2C2D
Applicable Products	4/6/8 inches
Applicable Processes	I-line、SOC、PI、KrF、ArF
Application Field	MEMS、ICs、advanced packaging、scientific research, etc.

BONA Semi-conductor —— Innovation in Chips, Unity in Progress