Core Equipment · Smart Future
Product Equipment
Bonding Machine
-
Automatic Permanent Bonding SystemRead More
This system is applied to wafer-level packaging for microsystems such as radio.. -
Automatic Temporary Bonding System With Adhesive CoatingRead More
The automatic Cassette-to-Cassette operation reduces manual intervention and... -
Automatic Temporary Bonding SystemRead More
This system is primarily used in the semiconductor power device industry... -
Automatic Temporary UV Film Bonding SystemRead More
This system is primarily used in fields such as integrated circuits and advanced
Debonding Machine
-
Automatic Laser Debonding and Cleaning Integrated SystemRead More
This system is suitable for the manufacturing processes of integrated circuits.. -
Automatic Debonding SystemRead More
This system is primarily used in the semiconductor power device industry... -
Automatic UV Debonding SystemRead More
This system is primarily used in fields such as integrated circuits and advanced
Cleaning Machine
-
Automatic High Pressure Cleaning SystemRead More
Suitable for advanced packaging, wafer fabrication, ICs, power electronics... -
Automatic Edge Bread Removal and Cleaning SystemRead More
This system is primarily used in the semiconductor power device industry. It inv -
Automatic Vacuum Pressure Cleaning SystemRead More
This system is primarily used in fields such as integrated circuits and advanced
Coating Machine
-
Automatic Glass Cleaning and Coating SystemRead More
This system is primarily used in the field of semiconductor power devices... -
Automatic Wafer Coating SystemRead More
This system is capable of coating and developing wafers and is suitable for proc -
Automatic Coating and Development MachineRead More
The heating plates utilise progressive baking method...
Testing Equipment
-
Automatic Wafer Bonding Void Detection SystemRead More
This system is primarily used to detect the number and size of bubbles (voids) a -
Helium and Fluorinated Oil Pressure Leak DetectorRead More
The automated leak detection device is applied to electronic components such... -
Automotive Grade Chip Helium Leak TesterRead More
Hermetic packaging inspection for automotive-grade chips, sealing verification f
BONA Semi-conductor —— Innovation in Chips, Unity in Progress
Copyright 2026 BONA Semi-conductor Equipment (ZheJiang) Co., LTD All Rights Reserved