Integrated Bonding & Debonding Solutions for Advanced Packaging
We integrate mechanical design, process development, precision fabrication and software engineering to deliver cost-effective equipment supporting the broader semiconductor sector.
Integrated Bonding & Debonding Solutions for Advanced Packaging
We integrate mechanical design, process development, precision fabrication and software engineering to deliver cost-effective equipment supporting the broader semiconductor sector.
Integrated Bonding & Debonding Solutions for Advanced Packaging
We integrate mechanical design, process development, precision fabrication and software engineering to deliver cost-effective equipment supporting the broader semiconductor sector.
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BONA Semi-conductor
A Pioneer of High-End Equipment for Advanced Packaging & Wafer Fabrication
BONA Semi-conductor Equipment (ZheJiang) Co., LTD is a high-end equipment manufacturer integrating mechanical design, process R&D, precision manufacturing and software development. We currently research, develop and produce core production equipment serving three major sectors: advanced packaging, display panels and semiconductor wafers.
About Us -
Products
Key Process Equipment Covering Three Major Industries
Products -
Careers
BONA Gathers Talents, Craftsmanship Builds Chip Future
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Deliver reliable equipment to create definite value for customers.
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Bonding Machine
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Debonding Machine
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Testing Equipment
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