BONA Semiconductor Speaks at Shaoxing IC Expo: Forging a New Blueprint for Advanced Packaging via Bonding Technologies

Summit Forum Exchange, Insight into the Future of Technology

From a grain of sand to a semiconductor chip, the development of the semiconductor industry has always relied on the support of precision equipment. Amid numerous challenges in the Post-Moore Era, temporary bonding and debonding, a critical process, not only determines the performance upgrade of thinned chips but also shapes the fate of the trillion-scale industry. The Shaoxing Integrated Circuit Industry Expo was grandly held at Shaoxing Olympic Sports Center from May 29 to 31, 2026. As a key intellectual segment of the expo, the concurrent Development Forum on Core Equipment and Components for Semiconductor Manufacturing gathered top experts and enterprise representatives from the advanced packaging sector nationwide. As a leading manufacturer of core equipment for advanced packaging, BONA Semiconductor Equipment (Zhejiang) Co., Ltd. (hereinafter referred to as BONA Semiconductor) was invited to attend the forum and delivered a landmark speech titled Chip Stacking, Bonding the Future: Core Technological Breakthroughs of Bonding & Debonding in Advanced Packaging, drawing widespread attention from the industry.

At the forum, Wang Maolin, Director of Process Development at BONA Semiconductor Equipment (Zhejiang) Co., Ltd., systematically elaborated on the strategic value and development trends of permanent bonding, temporary bonding and debonding technologies in advanced packaging. As Moore’s Law slows down and wafer manufacturing approaches physical limits, advanced packaging has become a vital pathway to sustain chip performance improvement and achieve higher integration density, driving innovations and evolution in cutting-edge fields including artificial intelligence, high-performance computing, and co-packaged silicon photonics. For advanced packaging applications, wafer thickness is generally less than 100 microns. Such ultra-thin wafers are highly susceptible to stress-induced cracking and warpage during processing. Temporary bonding and debonding technologies perfectly address this wafer handling challenge: ultra-thin device wafers are reversibly and temporarily bonded to carrier wafers to provide mechanical support for subsequent precision processes such as thinning and grinding, before the two wafers are accurately separated once core manufacturing steps are completed.

BONA Semiconductor has long taken a national lead in this critical track. The company has successfully launched three core products: temporary bonders, temporary debonders, and integrated temporary debonding & cleaning equipment. Over 85% of their components are independently developed, enabling full self-controllability, while customized solutions are available to meet specific demands of downstream clients. Notably, BONA Semiconductor has achieved rapid commercialization progress: its equipment has been deployed and mass-produced at leading domestic advanced packaging enterprises. Featuring advanced technologies, cost competitiveness, compact footprint and lightweight design, BONA’s products have broken the long-standing market monopoly held by overseas manufacturers, vigorously advancing the domestic substitution of core equipment for China’s advanced packaging industry.

Media Spotlight, Amplifying Domestic Chip Voice to the Public

BONA Semiconductor’s remarkable speech earned high praise on-site and drew in-depth coverage from mainstream media in Shaoxing. Wang Maolin, Director of Process Development, was interviewed by Shaoxing TV, sharing unique insights on the future development of temporary bonding and debonding technologies. Temporary bonding and debonding processes previously relied heavily on imported equipment, yet overseas suppliers often imposed unfair contractual terms alongside long delivery cycles and high pricing. BONA’s domestic equipment delivers equivalent performance with superior cost efficiency, offering a fully self-controllable new alternative for domestic advanced packaging manufacturers.

      The interview aired on Shaoxing TV’s evening news on June 1, vividly showcasing BONA Semiconductor’s technological breakthroughs and industrial contributions in bonding & debonding for advanced packaging, while conveying China’s confidence and resolve in independent innovation of core semiconductor equipment to the public.

Technology-driven Development, Forging a New Vision for Industrial Growth

BONA Semiconductor Equipment (Zhejiang) Co., Ltd. integrates mechanical design, electrical R&D, software development and precision manufacturing. It was co-founded by a core team with more than 16 years of cumulative experience in semiconductor IC manufacturing, 2.5D/3D advanced packaging and third-generation compound semiconductor technologies. Headquartered in Lingang Integrated Circuit Industrial Park within the Shanghai Pilot Free Trade Zone, the company operates a R&D center in Kangqiao, Zhangjiang Science City, alongside a 6,000+ ㎡ R&D, production and assembly base in Jiashan County, Jiaxing City, Zhejiang Province. Its Class 100 cleanroom R&D laboratory is open to clients, providing full-process sampling and testing services covering photoresist coating, plasma activation, permanent bonding, temporary bonding, temporary debonding and cleaning processes.

Over the past year, BONA Semiconductor completed nearly RMB 100 million in Series A financing with key support from the National SME Development Fund, marking a brand-new growth phase for the enterprise. Looking ahead, BONA Semiconductor will continue to research, develop and iterate front-end and back-end equipment centered on wafer temporary bonding & debonding processes, accelerate full-scale deployment in emerging application scenarios including compound semiconductors and MicroLED, and continuously push the technological boundaries of domestically manufactured core equipment for advanced packaging.

    Building on the successful forum speech and TV interview at the Shaoxing Integrated Circuit Expo, BONA Semiconductor will further deepen collaborative innovation with upstream and downstream industrial chain partners, speed up the application and promotion of domestic core advanced packaging equipment, and continuously empower the prosperous development of China’s semiconductor industry with higher-standard, higher-quality products and services. Chip Stacking, Bonding the Future — On the journey toward a powerful industrial nation, BONA Semiconductor forges ahead with down-to-earth efforts and draws a brand-new blueprint through innovative thinking.