Core Equipment · Smart Future
Product Equipment
Bonding Machine
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Automatic Permanent Bonding SystemRead More
This system is applied to wafer-level packaging for microsystems such as radio.. -
Automatic Temporary Bonding System With Adhesive CoatingRead More
The automatic Cassette-to-Cassette operation reduces manual intervention and... -
Automatic Temporary Bonding SystemRead More
This system is primarily used in the semiconductor power device industry... -
全自动临时UV膜键合机Read More
主要用于集成电路，先进封装等领域，为待减薄晶圆提供机械支撑。具有工序简单，键合温度相对低的优点，可大幅缩短键合工序所需时间。
Debonding Machine
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Automatic Laser Debonding and Cleaning Integrated SystemRead More
This system is suitable for the manufacturing processes of integrated circuits.. -
Automatic Debonding SystemRead More
This system is primarily used in the semiconductor power device industry... -
Automatic UV Debonding SystemRead More
This system is primarily used in fields such as integrated circuits and advanced
Cleaning Machine
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Automatic High Pressure Cleaning SystemRead More
Suitable for advanced packaging, wafer fabrication, ICs, power electronics... -
Automatic Edge Bread Removal and Cleaning SystemRead More
This system is primarily used in the semiconductor power device industry. It inv -
Automatic Vacuum Pressure Cleaning SystemRead More
This system is primarily used in fields such as integrated circuits and advanced
Coating Machine
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Automatic Glass Cleaning and Coating SystemRead More
This system is primarily used in the field of semiconductor power devices... -
Automatic Wafer Coating SystemRead More
This system is capable of coating and developing wafers and is suitable for proc -
Automatic Coating and Development MachineRead More
The heating plates utilise progressive baking method...
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