Core Equipment · Smart Future
主要特点
This system is primarily used in fields such as integrated circuits and advanced packaging to provide mechanical support for wafers during the thinning process. It offers the advantages of a simple process and a relatively low bonding temperature, which significantly reduces the time needed for bonding.
规格参数
| Bonding Temperature | RT~150℃ |
| Bonding Pressure | 10KN |
| Ultimate Vacuum | 100Pa |
| Alignment Accuracy | ≤100μm |
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