Core Equipment · Smart Future
主要特点
This system is primarily used to detect the number and size of bubbles (voids) after the bonding process in advanced packaging. Compared to ultrasonic testing, it offers the advantages of high detection accuracy, rapid testing and the elimination of the need for a pure water medium, as well as cost savings.
规格参数
| Detection Accuracy | <5μm |
| Substrate Material | Si、Glass、Sapphire |
| Warpage | ≤1mm |
| WPH | ≥6 |
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