Core Equipment · Smart Future
主要特点
This system is primarily used in the semiconductor power device industry, employing a laser de-bonding process combined with film peeling. Advantages include a dry process, zero pollution, a high production capacity, and cost savings.
规格参数
| Laser Wavelength | 1064nm or 355nm |
| Laser Power | 13W |
| Lift-off Method | Peel tape |
| WPH | ≥25 |
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