Advanced Packaging_Application__BONA Semi-conductor Equipment (ZheJiang) Co., LTD

Advanced Packaging

Focusing on advanced packaging processes including 2.5D/3D integration, Wafer Level Packaging (WLP) and Fan-out packaging, we supply core equipment such as fully automatic high-vacuum wafer bonders, fully automatic photoresist coaters and fully automatic 8-chamber high-pressure cleaning machines, empowering customers to achieve mass production with high-density interconnection, superior reliability and lower costs.

Typical Use Cases

Temporary Bonding & Debonding

Direct & Indirect Permanent Bonding

Hybrid Bonding

Advanced Packaging LAB-LDI

Mid-Process Cleaning & Metrology-Inspection

Bonding Machine

Debonding Machine

Cleaning Machine

Coating Machine

Testing Equipment

Industry Solutions