Automatic High Pressure Cleaning System_Cleaning Machine_Products__BONA Semi-conductor Equipment (ZheJiang) Co., LTD

Automatic High Pressure Cleaning System

1. Suitable for advanced packaging, wafer fabrication, ICs, power electronics and RF applications.

2. The system supports multiple wafer sizes and features various chuck and pin configurations to accommodate different types of wafer.

3. The system has a small footprint, high throughput, and high levels of integration.

BONA Semi-conductor —— Innovation in Chips, Unity in Progress