Core Equipment · Smart Future
主要特点
This system is primarily used in the semiconductor power device industry for low-pressure bonding at room temperature via UV curing. It offers advantages such as a simple process, high production capacity and cost savings.
规格参数
| Bonding Pressure | ≤100N |
| TTV | ≤3um |
| Registration Accuracy | ≤100μm |
| WPH | ≥25 |
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