Core Equipment · Smart Future
主要特点
Hermetic packaging inspection for automotive-grade chips, sealing verification for power modules (such as IGBTs and SiC), leak testing for MEMS sensor packaging, and leak detection for other electronic components requiring high reliability.
规格参数
IPressure Retention Capability | No leaks after 24 hours of pressure retention during high-pressure helium immersion at a maximum pressure of 0.5 MPa |
Core Sensitivity | 5*10-13pa·m3/s |
Pumping Speed | 35m3/h |
Maximum Test Port Pressure | 13mbar |
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