Core Equipment · Smart Future
主要特点
This system is capable of coating and developing wafers and is suitable for processes such as G-line and I-line. It primarily consists of a transport module, a process module, a heating and cooling module, a fluid supply module and an electrical control module. The standard configuration includes four process chambers. The number of process chambers and heating and cooling plates, as well as the front- and back-side cleaning functions, can be customized according to customer requirements.
规格参数
| Applicable Products | 8/12 inches |
| Gluing Rotation Speed | ≤6000rpm |
| Applicable Viscosity of Glue Pump | ≤20000CP |
| Alignment Accuracy | ≤100μm |
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