Automatic Temporary Bonding System With Adhesive Coating_Bonding Machine_Products__BONA Semi-conductor Equipment (ZheJiang) Co., LTD

Automatic Temporary Bonding System With Adhesive Coating

1. The automatic Cassette-to-Cassette operation reduces manual intervention and enhances the efficiency and consistency of mass production;

2. Modular design (integrating coating, baking, alignment, and bonding);

3. Different functional modules can be selected according to customer requirements.

BONA Semi-conductor —— Innovation in Chips, Unity in Progress