BONA Semiconductor: Bonding & Debonding Technologies Shine at SEMICON CHINA 2026

March 25, 2026, Shanghai – SEMICON China 2026, a grand event drawing global attention from the semiconductor industry, was grandly held at Shanghai New International Expo Centre. At this summit gathering cutting-edge technologies and industrial insights, BONA Semiconductor Equipment (Zhejiang) Co., Ltd. showcased a full lineup of core equipment under the theme Bonding & Debonding Technologies Usher in a New Era of Advanced Packaging, emerging as one of the most eye-catching technical highlights at the exhibition.

Throughout the exhibition, BONA Semiconductor’s booth was packed with visitors. Technical specialists and procurement managers from domestic and overseas advanced packaging, display and wafer manufacturing sectors stopped by for in-depth consultations. The star exhibits on display, including temporary bonders, debonders, photolithography coating & developing systems and ultra-precision cleaning equipment, alongside a full suite of advanced packaging process solutions, drew crowds of professional visitors for detailed exchanges thanks to stable process performance and fully self-controllable core technologies. Multiple clients expressed clear intentions for cooperation on site, while the company’s technical staff spent nearly all their time delivering presentations and answering questions, a testament to the industry’s high recognition and strong interest in BONA’s high-end equipment.

As a major highlight of the show, Wang Maolin, Director of Process Technology Development at BONA Semiconductor, delivered the closing keynote speech titled Bonding & Debonding Technologies Usher in a New Era of Advanced Packaging at the China Display Conference sub-forum AI Vision: OLED & Micro LED, Twin Engines of Display Industry. Wang noted that with the rapid advancement of artificial intelligence, 5G and high-performance computing, the traditional path of shrinking transistor feature sizes has hit physical limits, making 2.5D/3D vertical stacking the universal consensus across the industry. He systematically introduced two core technology portfolios: permanent bonding and temporary bonding & debonding, stressing that hybrid bonding represents the ultimate development direction, while temporary bonding and debonding serves as the critical enabler for thinning wafers below 100 microns. Delivered in accessible yet professional language, the speech combined sharp technical insights and forward-looking industrial vision, earning widespread acclaim from the audience.

About BONA Semiconductor

BONA Semiconductor Equipment (Zhejiang) Co., Ltd. is a high-end equipment manufacturer integrating mechanical design, process R&D, precision manufacturing and software development. We develop and produce core production equipment serving three major sectors: advanced packaging, display panels and semiconductor wafers. The company’s headquarters is located in Lingang Integrated Circuit Industrial Park within the Shanghai Pilot Free Trade Zone, with an R&D and marketing center in Kangqiao, Zhangjiang Science City, and a 6,000+ ㎡ R&D, production and assembly base in Jiashan County, Jiaxing City, Zhejiang Province.

Founded jointly by a team of senior specialists with over 16 years of extensive experience in semiconductor IC manufacturing, 2.5D/3D advanced packaging and third-generation compound semiconductor technologies, the company’s self-developed equipment has been qualified and listed as a certified supplier for multiple leading industrial enterprises. Leveraging its proprietary precision wafer equipment assembly technology, advanced packaging process expertise, and a comprehensive technical platform covering laser processing, cleaning, dicing and metrology, BONA Semiconductor persists in independent R&D and technological innovation, dedicated to delivering cost-effective products and reliable services for clients across the broader semiconductor industry.